Qualcomm introduced its latest next-generation modem for smartphones, the Qualcomm Snapdragon X70 5G, during the present Mobile World Congress. It includes new features as well as faster uplink and downlink speeds.
While Qualcomm has not confirmed it, it is probable that this new model will be used for the next Snapdragon 8 Gen 2 processor, which is slated to be released this year.
The Snapdragon X70, according to Qualcomm, can deliver up to 10Gbps downlink speed and a peak upload speed of 3.5Gbps, providing maximum performance. It’s worth noting that the real-world performance will differ from what the business claims.
The utilisation of artificial intelligence (AI) technologies to enhance the mmWave and sub-6GHz bands is the main highlight of this new modem. It uses an AI-based channel-state feedback and optimization method to boost downlink and uplink average speeds.
Qualcomm Technologies, Inc. today announced the Snapdragon X70 5G ModemRF System, its fifth-generation 5G modem-to-antenna solution. Snapdragon X70 introduces the world’s first 5G AI processor in an RF modem system, to harness the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads, blazing upload speeds, low latency, coverage and energy efficiency. The Snapdragon X70’s unparalleled capabilities provide maximum flexibility for global 5G operators to maximize spectrum resources for the best possible 5G connectivity.
Snapdragon X70 introduces the Qualcomm 5G AI suite, engineered for 6GHz artificial intelligence and mmWave 5G link optimizations for improved speed, range, latency, mobility, link strength and power efficiency to power the Connected Intelligent Edge. Based on the global success of Snapdragon X65, X60, X55 and X50 solutions, Snapdragon X70 provides maximum flexibility for global operators to maximize spectrum resources to implement the best possible 5G connectivity for consumers, businesses and Connected Intelligent Edge.
Snapdragon X70 inherits the unparalleled 10 Gigabit 5G maximum download speed from its predecessor and includes new advanced features such as Qualcomm 5G AI Suite, Qualcomm 5G UltraLow Latency Suite and 4X carrier aggregation for unprecedented speed 5G, coverage, signal quality and low latency. Snapdragon X70’s Qualcomm 5G UltraLow Latency Suite enables OEMs and carriers to minimize latency for hyper-responsive 5G user experiences and applications.
“Our fifth-generation RF modem system extends our global leadership in 5G and the introduction of native 5G AI processing creates a platform and game-changer for performance-enhancing innovations,” said Durga Malladi, Senior Vice President and General Manager, 5G, Mobile Broadband and Infrastructure. , Qualcomm Technologies, Inc. “Snapdragon X70 is an example of how we are realizing the full potential of 5G and enabling an intelligently connected world. Snapdragon X70 presents the new Qualcomm 5G Powersave on January 3, January 3, associated with a basic band of 4NM and advanced modem technologies such as tracking the Qualcomm® QET7100 broadband envelope and adaptive tuning antenna.
Snapdragon X70 is equipped with the most comprehensive feature set in the mobile industry, allowing it to deliver greater 5G performance on more networks across the world. Its fibre-like surfing speeds and latency, provided via 5G wirelessly, open the path for the next generation of connected apps and experiences.
Devices with all of the Snapdragon X70’s key capabilities, as well as best-in-class Qualcomm® FastConnectTM Wi-Fi/Bluetooth systems, are eligible for the new ‘Snapdragon Connect’ badge [link to blog post], which emphasises the use of the best connectivity technologies available in Snapdragon Platforms.