The first HPC-focused N4X process technology is introduced by TSMC.

N4X process technology was introduced, which is appropriate for the severe expectations of High-Performance Computing (HPC) devices. N4X represents the greatest performance and maximum clock frequencies in the 5-nanometer family and is the first of TSMC‘s specialised HPC technology solutions.

TSMC's specialised HPC technology solutions

The “X” designation is reserved for TSMC technologies developed specifically for HPC products. Leveraging its expertise in 5nm volume production, TSMC further enhanced its technology with features ideal for high-performance computing products to create N4X. These features include:

N4X features for high-performance computing products

⧭High driving current and maximum frequency are maximised in device design and construction.

⧭Optimizing the back-end metal stack for high-performance designs

⧭metal-insulator-metal capacitors with a very high density for reliable power supply under quality and performance loads

Its HPC capabilities will enable the N4X to give up to a 15% performance boost over the N5 and a 4% performance boost over the 1.2 volt N4P. The N4X can generate driving voltages of more than 1.2 volts and offers improved performance. Customers can also use the N5 process’s shared design standards to speed up the creation of their N4X products. By the first half of 2023, TSMC anticipates N4X to be in production at risk. 

“HPC is now TSMC’s fastest-growing business segment and we are proud to introduce N4X, the first in line. “X” of our extreme performance semiconductor technologies. Said Dr Kevin Zhang, senior vice president of business development at TSMC. “The demands of the HPC segment are relentless and TSMC has not only adapted our ‘X’ semiconductor technologies to release maximum performance but has also combined them with our advanced 3DFabric ™ packaging technologies to provide the best platform. HPC. TSMC’s HPC  Not only does N4X technology provide performance-optimized silicon, but it also provides maximum design flexibility with its superior 3DFabric packaging technologies and a broad design activation platform through our global partners. TSMC’s open innovation platform is a part of this ecosystem.