TSMC, the semiconductor manufacturing behemoth behind Apple Silicon and MediaTek’s flagship Dimensity chipsets of 2022, has revealed that large scale production of its 3nm CPUs will begin in the second half of 2022 (H2 2022).
According to Digitimes, TSMC CEO Mr CC Wei confirmed in an earnings press briefing today that the company will begin mass production of its processors based on the 3nm node process(N2) in the second half of this year as planned, and its 2-nanometer process(N2) semiconductors are expected to go into mass production in 2025.
Tsmc producing 3nm chips in h2 2022
Mr Wei highlighted in the briefing that the business is convinced that the new node, using the newest N3 technology, would be able to fulfil user expectations and needs by delivering improved power efficiency and support for higher computational performance than its predecessors. Mr Wei also stated that the business has gotten a lot of interest and engagement for its N3 technology and that the company expects N3 to have more new tape-outs in the first year than N5(5nm) and N7 (7nm).
According to industry sources, once N3 enters mass production, TSMC will produce between 30,000 and 35,000 N3 chip wafers each month for its clients.
Because the chip wafers will be mass-produced relatively soon, it is also projected that devices equipped with chipsets fabricated on TSMC’s N3 process would be available in H2 2022. The good news is that, according to Digitimes, Apple may be the first brand to use TSMC’s cutting-edge technology. This is due to the fact that Apple is expected to release a new iPad this year equipped with Apple Silicon, which will be produced using TSMC N3 process in H2 2022.
But, we may not see broad use of TSMC N3 technology until 2023, since intends to ramp up manufacturing of its N3 wafers in 2023. In 2024, TSMC N3 might be found in the rumoured Apple A17 Bionic processors for the iPhone 15 series, as well as Qualcomm Snapdragon 8 Gen 3 chips and MediaTek Dimensity 9200 chips for the Android flagship market.