The first Low Power Compression Attached Memory Module (LPCAMM) form factor, created by Samsung Electronics, a global leader in advanced memory technology, is anticipated to revolutionize the DRAM market for PCs and laptops, as well as perhaps even data centers. Through Intel’s platform, Samsung’s ground-breaking development for its 7.5 gigabits per second (Gbps) LPCAMM has finished system verification.
LPDDR DRAM, or DDR-based So-DIMMs, have historically been utilized in PCs and laptops. Â Although LPDDR is small, because it is permanently affixed to the motherboard, it is difficult to change during maintenance or upgrades. In contrast, So-DIMMs are simple to attach and remove but have performance and other physical constraints.
LPCAMM addresses the growing need for more effective yet small devices by overcoming the drawbacks of both LPDDR and So-DIMMs. Because it is a removable module, LPCAMM provides more manufacturing flexibility for PC and laptop makers. LPCAMM takes up up to 60% less space on the motherboard than So-DIMM. As a result, interior space may be used more effectively, and performance and power efficiency can increase by as much as 50%.
Due to its power-saving capabilities, LPDDR has become a popular choice for servers since it may increase total cost of ownership (TCO) effectiveness. However, when expanding a server’s DRAM specs, adopting LPDDR might lead to operational issues, including replacing the entire motherboard. These problems are addressed by LPCAMM, which opens up a lot of opportunities for it to take over as the preferred option for servers and data centers in the future.
Dr. Dimitrios Ziakas, Intel’s Vice President of Memory & IO Technology, called the new form factor a “game changer” in the current PC industry because of its energy efficiency and repairability benefits. “We’re thrilled to be a part of the new standard enabling the client PC ecosystem and laying the foundation for broader market segment adoption and innovation in the future.”
“LPCAMM is expected to gain wide adoption in PCs, laptops, and data centers,” said Yongcheol Bae, Executive Vice President of Samsung Electronics’ Memory Product Planning Team. “With the growing demand in innovative memory solutions encompassing high performance, low power consumption, and manufacturing flexibility across various fields,” he added. Samsung is committed to aggressively seeking possibilities to increase the market for LPCAMM solutions and working closely with the sector to investigate new uses for them.
Major clients will test LPCAMM this year utilizing next-generation systems, and commercialization is scheduled for 2024.
