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The Qualcomm X70 5G modem is first 5G AI processor to be announced
Qualcomm introduced its latest next-generation modem for smartphones, the Qualcomm Snapdragon X70 5G, during the present Mobile World Congress. It includes new features as well as faster uplink and downlink speeds.
While Qualcomm has not confirmed it, it is probable that this new model will be used for the next Snapdragon 8 Gen 2 processor, which is slated to be released this year.
The Snapdragon X70, according to Qualcomm, can deliver up to 10Gbps downlink speed and a peak upload speed of 3.5Gbps, providing maximum performance. It’s worth noting that the real-world performance will differ from what the business claims.
The utilisation of artificial intelligence (AI) technologies to enhance the mmWave and sub-6GHz bands is the main highlight of this new modem. It uses an AI-based channel-state feedback and optimization method to boost downlink and uplink average speeds.
Qualcomm Technologies, Inc. today announced the Snapdragon X70 5G ModemRF System, its fifth-generation 5G modem-to-antenna solution. Snapdragon X70 introduces the world’s first 5G AI processor in an RF modem system, to harness the power of AI for breakthrough 5G performance with 10 Gigabit 5G downloads, blazing upload speeds, low latency, coverage and energy efficiency. The Snapdragon X70’s unparalleled capabilities provide maximum flexibility for global 5G operators to maximize spectrum resources for the best possible 5G connectivity.
Apple recently a patent for Magic Keyboard with a Mac integrated
Apple’s patent application for an entirely new computing device idea was released today by the US Patent & Trademark Office. All envision a Magic Keyboard-like gadget that can be plugged into any display in a home or workplace to house a full computer.
Many users own or run computing equipment that is used often, if not solely, in a certain place, such as a desktop computer at an office or a home office. A tower (e.g., a stand-alone enclosure containing the computer’s CPU, memory, and other components), one or more computer displays, and one or more input devices, such as a keyboard, mouse, trackpad, or a combination thereof, are all examples of computing equipment.
The features, designs, and system architectures mentioned for combination computing and input devices can allow for desired levels of performance while preserving a form factor that is the same as or comparable to that of a standard input device.
While working, the processing unit might create heat, which can have a detrimental influence on its performance. The base, on the other hand, can be made up to some extent of a material that distributes or spreads heat substantially through the mass of the base (i.e., thermally conductive), thereby more evenly spreading or distributing heat generated by the processing unit over a larger surface area of the base and thus more effectively regulating computing device operating temperatures. Copper, aluminium, brass, steel, and bronze are just a few examples of thermally conductive materials.
patent application number: 20220057845