The chipset is essentially a stripped-down version of the Dimensity 1100 SoC, but it is the company’s first processor to include dual mmWave and sub-6GHz 5G connection.
Specifications for the MediaTek Dimensity 1050
A MediaTek Dimensity 1050 is an octa-core processor with two ARM Cortex-A78 performance cores clocked at 2.5GHz and constructed using a 6nm technology. While the business hasn’t said anything about efficiency cores, they’re most likely six ARM Cortex-A55.
It also has an ARM Mali-G610 graphics processor and support for MediaTek’s HyperEngine 5.0 suite of optimization tools and features for improved gaming performance.
The CPU supports Full HD+ resolution panels with a refresh rate of up to 144Hz, as well as hardware-accelerated AV1 video decoding, HDR10+ playback, and Dolby Vision.
It supports 3CC carrier aggregation on the sub-6GHz (FR1) spectrum and 4CC carrier aggregation on the mmWave (FR2) spectrum, with up to 53% higher downlink rates than LTE + mmWave aggregation. For speedy Wi-Fi access, it also supports Wi-Fi 6E and a 22 MIMO antenna.
The business has not provided any other details on this chip, but it has stated that devices based on the MediaTek Dimensity 1050 would be available in the market between July and September of this year.
Dimensity 930 and Helio G99 specs from MediaTek
The Dimensity 930 and Helio G99 chipsets were also introduced by MediaTek. The former is a 5G-capable chipset that promises better download rates with 2CC-CA, as well as mixed duplex FDD+TDD for increased speeds and range. MiraVision HDR video playback, 120Hz Full HD+ monitors, and HDR10+ video are all supported.
The gaming features in HyperEngine 3.0 Lite include sophisticated multi-network management to ensure lower latency for smoother user experiences and longer battery life. In the second quarter of 2022, phones powered by the Dimensity 930 will be available.