Samsung new Exynos Modem 5300 is faster, power-efficient

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Exynos Modem 5300, a new-generation 5G modem from Samsung, has been introduced. The Exynos Modem 5300 is anticipated to be used in the upcoming Google Tensor chipset, which could power the Pixel 8 and Pixel 8 Pro. Generally, the South Korean company’s most recent cellular modems make their debut inside the most recent Exynos processors, but since the company didn’t release its flagship Exynos processor until 2023, this isn’t the case this time.

Samsung Foundry uses a 4nm EUV fabrication technique to create the Exynos Modem 5300 5G, which is a substantial improvement over the 7nm EUV fabrication process used to develop the Exynos Modem 5123. As a result, the Exynos Modem 5300 uses a lot less power than modems from earlier generations.

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The FR1, FR2, and EN-DC (E-UTRAN New Radio Dual Connectivity) technologies are supported by this mobile communications chip, which delivers peak download rates of up to 10Gbps and ultra-low latency. There are claims of up to 3.87Gbps peak upload speeds. SA (Standalone) and NSA (Non-Standalone) modes enable 5G networks operating at mmWave and sub-6GHz.

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Exynos 5300 using a 4nm process

It works with the 5G NR Release 16 standard from the 3GPP, which seeks to make 5G networks significantly quicker and more effective. The Exynos Modem 5300 enables peak download rates of up to 3Gbps and peak upload speeds of up to 422Mbps when used in LTE mode. A PCIe connection may be used to attach it to a smartphone chipset.

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On paper, Qualcomm’s Snapdragon X70 Modem, which can deliver up to 10Gbps download speeds and up to 3.5Gbps upload rates on compatible 5G networks, and Samsung’s Exynos Modem 5300 look to be comparable. Both were developed by Samsung’s System LSI division. If Samsung’s new 5G modem supports the Dual-SIM Dual-Active functionality hasn’t been made public, though.

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Packed for a design approach

Indeed, we can easily build a 5G device. Key components are integrated inside the Exynos Modem 5300 chipset to simplify and streamline product design. The modem, supply modulator, clock buffer, phase array, PMIC, antenna module, and other components of the chipset are used to control device connectivity and boost battery life. Also, the Exynos Modem 5300 has a built-in PCIe connection with a portable processor that offers low latency and fast data transfer speeds.

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Specifications

  • 5G NR
    3GPP Rel. 16
    Sub-6GHz, mmWave
    NSA/SA
  • Supported Modes
    LTE-FDD, LTE-TDD, HSPA, TD-SCDMA, WCDMA, CDMA, GSM/EDGE
  • Downlink Features
    NR DL aggregated bandwidth
    200 MHz for sub 6GHz,
    800 MHz for mmWave
    4×4 MIMO in sub-6GHz
    2×2 MIMO in mmWave
    Up to 256-QAM in sub-6GHz
    Up to 64-QAM in mmWave
  • Uplink Features
    NR UL aggregated bandwidth
    400 MHz for sub 6GHz,
    800 MHz for mmWave
    2×2 MIMO
    Up to 256-QAM in sub-6GHz
    Up to 64-QAM in mmWave
  • Process
    4nm EUV Process

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