SK Hynix announced the industry’s best-performing GDDR7 graphics memory

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SK Hynix announced the release of GDDR7. It is a next-gen graphics memory product with the highest performance in the industry. 

Visuals DDR (GDDR): a graphics DRAM standard from JEDEC. It aims for faster graphic processing. GDDR7 is the new generation, replacing GDDR3, GDDR5, GDDR5X, and GDDR6. The next generation of memory chips promises faster, more efficient chips. GDDR has become one of the most popular types of AI.

Visuals DDR (GDDR): a graphics DRAM standard from JEDEC. It aims for faster graphics processing. GDDR7 has replaced GDDR3, GDDR5, GDDR5X, and GDDR6. The new generation promises faster, more energy-efficient memory chips. As a result, GDDR is now a popular memory chip for AI.

In March, the creators developed GDDR7. It coincided with a rise in global demand for DRAM products. Clients want fast, high-performance chips for AI graphics processing. According to the corporation, volume production will begin in the upcoming third quarter.

The operational speed of the new device is 32 Gbps, which is 60% faster than the previous generation. Depending on the situation, the speed can increase to 40 Gbps. The gadget can process data at 1.5TB per second. That’s 300 Full-HD (5GB) movies, in a second, with high-end graphics cards.

Additionally, SK Hynix introduced new packaging technology to tackle the heat problem caused by fast data processing, leading to over a 50% increase in power efficiency compared to the previous version.

The company employed EMC for the packing material and added two more layers to the heat-dissipating substrates, resulting in a 74% reduction in thermal resistance compared to the previous generation. The product’s dimensions remained unaltered.

Semiconductor packaging relies on EMC to seal chips and safeguard them from heat, humidity, shock, and charge.

Thermal resistance quantifies a material’s resistance to heat transfer by determining the temperature generated by a watt. Better heat-dissipation efficiency results from a lower thermal resistance because heat dissipates more readily when a variable temperature is applied.

According to SK Hynix’s Sangkwon Lee, GDDR7 is expected to be utilized in a wider range of applications, including high-end 3D graphics, artificial intelligence, high-performance computing, and autonomous vehicles.

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