Samsung Develops First GDDR7 DRAM: Next Gen of Graphics Performance


The first Graphics Double Data Rate 7 (GDDR7) DRAM on the market has been developed by Samsung Electronics, a global leader in cutting-edge semiconductor technology. This year, it will be implemented for the first time in next-generation systems of important clients for verification, propelling the graphics market’s future growth and solidifying Samsung’s technological supremacy in the space.

After Samsung created the first 24Gbps GDDR6 DRAM in the market in 2022, its 16-gigabit (Gb) GDDR7 product will provide the fastest speed to date in the market. Integrated circuit (IC) design and packaging advancements give operations at high speeds more stability.


According to Yongcheol Bae, Executive Vice President of Memory Product Planning Team at Samsung Electronics, “Our GDDR7 DRAM will help elevate user experiences in areas that require outstanding graphics performance, such as workstations, PCs, and game consoles, and is expected to expand into future applications such as AI, high-performance computing (HPC), and automotive vehicles.” In accordance with market demand, the following-generation graphics DRAM will be released, and we intend to keep holding the top position in the market.

The impressive 1.5 terabytes per second (TBps) capacity of Samsung’s GDDR7 is 1.4 times greater than that of GDDR6 1.1 TBps and includes an increased pin speed of up to 32Gbps. The improvements are made feasible by the new memory standard’s adoption of the Pulse Amplitude Modulation (PAM3) signalling technique rather than the Return to Zero (NRZ) of prior generations. Within the same signalling cycle, PAM3 permits 50% more data transmission than NRZ.


Importantly, the most recent version is 20% more energy efficient than GDDR6 thanks to power-saving design technology that is geared toward high-speed operations. Samsung provides a low-operating voltage option for devices that are particularly conscious about power consumption, including laptops.

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In addition to IC architecture optimization, a packaging material with high thermal conductivity called an epoxy moulding compound (EMC) is utilized to reduce heat generation. By drastically reducing thermal resistance by 70% compared to GDDR6, these advancements enable reliable product performance even when high-speed operations are implemented.


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