The specs for Qualcomm snapdragon 898 and MediaTek Dimensity 2000 have been leaked.

 Later this year, the Qualcomm snapdragon 898 and mediaTek Dimensity 2000 flagship chipsets are scheduled to be released.

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Qualcomm’s Snapdragon 898 processor is likely to be unveiled at its annual summit in December. According to rumours, the chipset will power the majority of Android flagships in 2022, starting with the Galaxy S22. Similarly, the Dimensity 2000 chipset is reported to be in the works at MediaTek. Now, a reliable Weibo source has revealed some further details about the chipsets, hinting at what’s to come. The MediaTek Dimensity 2000 chipset’s release date is currently unknown, but we may anticipate it to arrive later this year or early next year.

Qualcomm Snapdragon 898

The Snapdragon 898 would have an octa-core CPU with a cortex-X3 based main core clocked at 3.0GHz and 3x Cortex-A710 performance cores clocked at 2.5GHz. The cores based on the energy-efficient Cortex-A510 will be clocked at 1.79 GHz. To manage graphic demands, the chipset will be combined with the Adreno 730 GPU. What improvements it will offer over the Adreno 660, on the other hand, is yet to be seen.

MediaTek Dimensity 2000

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Similarly, the Dimensity 2000 will have the same configuration as the Snapdragon 898, but the cluster of three performance cores will be clocked at 2.85GHz, which is significantly faster than the Snapdragon 898. For graphics, the chipset will be coupled with the Mali G710 MC10 GPU. The chipset will be built using TSMC’s 4nm manufacturing process, thus performance should be consistent and similar to the Snapdragon flagship SoCs. Once the chipset is formally revealed and made accessible to OEMs, we should expect companies like Redmi, Realme, OPPO, and others to line up phones.

See also  MediaTek Dimensity 9200 with TSMC N4P, Arm Cortex-X3, and ray tracing is now released


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